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Search for "triple junctions" in Full Text gives 8 result(s) in Beilstein Journal of Nanotechnology.

Assembly of metallic nanoparticle arrays on glass via nanoimprinting and thin-film dewetting

  • Sun-Kyu Lee,
  • Sori Hwang,
  • Yoon-Kee Kim and
  • Yong-Jun Oh

Beilstein J. Nanotechnol. 2017, 8, 1049–1055, doi:10.3762/bjnano.8.106

Graphical Abstract
  • grooving and breakage of the film at the edges of the pits (or mesas) with high curvature before the film breaks at GB triple junctions [1][12][13]. This mechanism enables the formation of a single isolated particle inside the pit. If the as-deposited polycrystalline film is so thin that it has high
  • can increase with increasing annealing temperature. This is attributable to the faster dewetting kinetics at higher temperatures, which induces rapid breakage of the film along the mesa with high surface curvature and fast retraction of the film edges, preventing both film thinning at GB triple
  • junctions and the agglomeration of the film across the pits. Figure 7a–c shows the size distribution of NPs dewetted at different temperatures for a 14 nm thick Ag film. With increasing dewetting temperature, the plots became narrower, eliminating fine and coarse particles. At 500 °C, the plot showed the
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Published 12 May 2017

Diffusion and surface alloying of gradient nanostructured metals

  • Zhenbo Wang and
  • Ke Lu

Beilstein J. Nanotechnol. 2017, 8, 547–560, doi:10.3762/bjnano.8.59

Graphical Abstract
  • 300 nm. Therefore, the contribution from triple junctions, of which the amount increases with decreased grain size and the diffusivity should be further enhanced due to the larger excess volume [31][37], might be insignificant within the present grain size scale. This evidence suggests that GBs in the
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Review
Published 03 Mar 2017

Annealing-induced recovery of indents in thin Au(Fe) bilayer films

  • Anna Kosinova,
  • Ruth Schwaiger,
  • Leonid Klinger and
  • Eugen Rabkin

Beilstein J. Nanotechnol. 2016, 7, 2088–2099, doi:10.3762/bjnano.7.199

Graphical Abstract
  • boundaries and triple junctions [7][8], voids at the interface between the film and the substrate [9], and localized impurities on the substrate or on the film surface can serve as nucleation sites for the onset of solid-state dewetting upon heating. Localized plastic deformation by indents on the film
  • several micrometers. In the case of the thicker films studied in the present work (the total thickness is 50 nm), the average grain size was comparable to the film thickness (Figure 1a). Triple junctions are clearly observed between the majority of grains, which is typical of a polycrystalline film. The
  • presence of triple junctions in the film is related to the deviations from the ideal Σ3 misorientation between the grains, as also confirmed by an angular spread of the {111} reflections in the X-ray diffraction (XRD) pole figure shown in Figure 1b. Indeed, thin films with the perfect <111> texture, in
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Published 28 Dec 2016

A new approach to grain boundary engineering for nanocrystalline materials

  • Shigeaki Kobayashi,
  • Sadahiro Tsurekawa and
  • Tadao Watanabe

Beilstein J. Nanotechnol. 2016, 7, 1829–1849, doi:10.3762/bjnano.7.176

Graphical Abstract
  • boundary microstructures have been seriously considered according to the almost established approach to GBE. This approach has been increasingly recognized for the development of high performance nanocrystalline materials with an extremely high density of grain boundaries and triple junctions. The
  • effectiveness of precisely controlled grain boundary microstructures (quantitatively characterized by the grain boundary character distribution (GBCD) and grain boundary connectivity associated with triple junctions) has been revealed for recent achievements in the enhancement of grain boundary strengthening
  • grain boundaries and triple junctions. This is often associated with the nonequilibrium deformation of microstructures introduced by severe plastic deformation (SPD) with less thermal stability, excess structural defects and chemical composition by segregation to grain boundaries and interfaces [12][15
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Review
Published 25 Nov 2016

Effect of triple junctions on deformation twinning in a nanostructured Cu–Zn alloy: A statistical study using transmission Kikuchi diffraction

  • Silu Liu,
  • Xiaolong Ma,
  • Lingzhen Li,
  • Liwen Zhang,
  • Patrick W. Trimby,
  • Xiaozhou Liao,
  • Yusheng Li,
  • Yonghao Zhao and
  • Yuntian Zhu

Beilstein J. Nanotechnol. 2016, 7, 1501–1506, doi:10.3762/bjnano.7.143

Graphical Abstract
  • -pressure torsion. It was found that in 83% of grains containing twins, at least one twin intersects with a triple junction. This suggests that triple junctions could have promoted the nucleation of deformation twins. It should be cautioned that this technique might be unable to detect extremely small
  • nanoscale twins thinner than its step size. Keywords: nanocrystalline materials; transmission Kikuchi diffraction; triple junctions; twins; Introduction The Hall–Petch relationship has inspired materials scientists to refine grains to increase the strength of materials since the early 1950s [1][2][3
  • has been found as the primary mechanism from both simulations [12][13] and experiments [14][15]. However, it still remains unclear whether such emissions from grain boundaries have any preference for sites with specific character such as triple junctions. This problem is of significant importance to
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Published 24 Oct 2016

Formation of CuxAu1−x phases by cold homogenization of Au/Cu nanocrystalline thin films

  • Alona Tynkova,
  • Gabor L. Katona,
  • Gabor A. Langer,
  • Sergey I. Sidorenko,
  • Svetlana M. Voloshko and
  • Dezso L. Beke

Beilstein J. Nanotechnol. 2014, 5, 1491–1500, doi:10.3762/bjnano.5.162

Graphical Abstract
  • several orders of magnitude, depending on the type of GB structure (low or high angle GBs [5], triple junctions [6]). Furthermore it can be observed at very low temperatures that the morphology of the formation and the growth of the new phase(s) can be different from the usual planar growth of a reaction
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Published 10 Sep 2014

Grain boundaries and coincidence site lattices in the corneal nanonipple structure of the Mourning Cloak butterfly

  • Ken C. Lee and
  • Uwe Erb

Beilstein J. Nanotechnol. 2013, 4, 292–299, doi:10.3762/bjnano.4.32

Graphical Abstract
  • of the Mourning Cloak butterfly is covered with randomly distributed tiny hairs (about 4 µm in diameter), which usually grow at the triple junctions between the ommatidia. In Figure 1, the bases of fractured hairs are visible on three of the triple junctions. Figure 1 also shows areas with
  • arrangements on various butterflies similar structures were referred to as local domain arrangements [6]. For the remainder of this study, nipple arrangements located at least 4 µm away from triple junctions and facet boundaries in contamination-free areas of the eye were selected. Figure 3 shows a high
  • /macro-defect-free regions. Scanning electron micrograph showing the facet structure of the Mourning Cloak butterfly. Note the bases of fractured hair at some of the triple junctions (magnification: 800×). Triple junction in the facet structure and nanonipples in three adjacent facets (magnification
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Published 02 May 2013

Formation of precise 2D Au particle arrays via thermally induced dewetting on pre-patterned substrates

  • Dong Wang,
  • Ran Ji and
  • Peter Schaaf

Beilstein J. Nanotechnol. 2011, 2, 318–326, doi:10.3762/bjnano.2.37

Graphical Abstract
  • , and then proceeds with void growth and particle formation. For polycrystalline films on the flat substrates, void nucleation is generally thought to occur due to grain boundary grooving, via surface diffusion at the grain boundaries, and grain boundary triple junctions which intersect the substrate
  • boundary triple junctions, which scale with the particle size and spacing for the dewetted particles in an approximate manner, increase with the film thickness. So it is expected that the nucleated void density decreases with increasing film thickness. In addition, an experimental investigation from Jiran
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Published 22 Jun 2011
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